A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon Via (TSV) interface

Autor:	Chulwoo Kim, Jabeom Koo, Young Jung Choi, Kunwoo Park, Byong Tae Chung, Hyun-Woo Lee, Yunsaing Kim, Soo Bin Lim, Jong Ho Kang, Dae Han Kwon, Junyoung Song
Rok vydání:	2012
Předmět:	Random access memory Power demand business.industry Computer science Electrical engineering Solid-state business Electronic circuit
Zdroj:	2012 IEEE International Solid-State Circuits Conference.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b6b27e13d2b7b742347c8c43986f3a89 https://doi.org/10.1109/isscc.2012.6176873 Zobrazit plný text záznamu