Flexible CMOS chip converted by a novel chip transformation process
| Autor: | Arindam Sanyal, Junyu Lai, Sanjeev Tannirkulam Chandrasekaran, Jung-Hun Seo |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Plasma etching business.industry 020208 electrical & electronic engineering Process (computing) Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Substrate (printing) Chip Flexible electronics CMOS Etching (microfabrication) Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Optoelectronics Electrical and Electronic Engineering business Voltage |
| Zdroj: | Electronics Letters. 56:1335-1337 |
| ISSN: | 1350-911X 0013-5194 |
| DOI: | 10.1049/el.2020.2235 |
| Popis: | In this Letter, the authors report a flexible CMOS chip converted by a novel chip transformation process. To realise a truly flexible CMOS chip, a two-step etching process was employed in the transformation process: (i) vapour etching to remove inter-dielectric layers followed by polymer encapsulation and (ii) plasma etching to remove the substrate of the chip. The I–V results measured after the chip transformation process show a voltage variance of |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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