Chemical Bonding of Copper and Epoxy Through Thiol Based Self-Assembled Layer for Post 5g/6g Semiconductors
| Autor: | Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Katsuaki Suganuma |
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| Rok vydání: | 2022 |
| Zdroj: | SSRN Electronic Journal. |
| ISSN: | 1556-5068 |
| Databáze: | OpenAIRE |
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