| Autor: |
Piet Bergveld, Wouter Olthuis, Johan G. Bomer, D.A. Kronemeijer, E.A. Dijkstra |
| Rok vydání: |
2002 |
| Předmět: |
|
| Zdroj: |
2001 Microelectromechanical Systems Conference (Cat. No. 01EX521). |
| DOI: |
10.1109/memsc.2001.992731 |
| Popis: |
This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180/spl deg/C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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