High-Power-Density Skutterudite-Based Thermoelectric Modules with Ultralow Contact Resistivity Using Fe–Ni Metallization Layers
Autor: | Kimin Hong, Sang-Hyun Park, Yeongseon Kim, Joonil Cha, Hana Yoon, Younghwan Jin, Chung-Yul Yoo, In Chung |
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Rok vydání: | 2018 |
Předmět: |
Materials science
Diffusion barrier business.industry Energy Engineering and Power Technology 02 engineering and technology engineering.material 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Electrical contacts 0104 chemical sciences Thermoelectric generator Thermal conductivity Electrical resistivity and conductivity Seebeck coefficient Thermoelectric effect Materials Chemistry Electrochemistry engineering Chemical Engineering (miscellaneous) Optoelectronics Skutterudite Electrical and Electronic Engineering 0210 nano-technology business |
Zdroj: | ACS Applied Energy Materials. 1:1603-1611 |
ISSN: | 2574-0962 |
DOI: | 10.1021/acsaem.8b00064 |
Popis: | Most reported thermoelectric modules suffer from considerable power loss due to high electrical and thermal resistivity arising at the interface between thermoelectric legs and metallic contacts. Despite increasing complaints on this critical problem, it has been scarcely tackled. Here we report the metallization layer of Fe–Ni alloy seamlessly securing skutterudite materials and metallic electrodes, allowing for a minimal loss of energy transferred from the former. It is applied to an 8-couple thermoelectric module that consists of n-type (Mm,Sm)yCo4Sb12 (ZTmax = 0.9) and p-type DDyFe3CoSb12 (ZTmax = 0.7) skutterudite materials. It performs as a diffusion barrier suppressing chemical reactions to produce a secondary phase at the interface. Consequent high thermal stability of the module results in the lowest reported electrical contact resistivity of 2.2–2.5 μΩ cm2 and one of the highest thermoelectric power density of 2.1 W cm–2 for a temperature difference of 570 K. Employing a scanning transmission el... |
Databáze: | OpenAIRE |
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