| Popis: |
Ion plating is a plasma deposition technique where ions of the gas and the evaporant have a decisive role in the formation of a coating in terms of adherence, coherence, and morphological growth. The range of materials that can be ion plated is predominantly determined by the selection of the evaporation source. Based on the type of evaporation source, gaseous media, and mode of transport, the following will be discussed: resistance, electron beam, reactive ion beam evaporation, and sputtering. Ionization efficiencies and evaporant energies in the glow discharge determine the percentage of atoms which are ionized under typical ion plating conditions. The plating flux consists of a small number of energetic ions and a large number of energetic neutrals. The plating flux energy distribution ranges from thermal energies up to the voltage applied to the discharge. The various reaction mechanisms which contribute to the exceptionally strong adherence—formation of a graded substrate/coating interface are not fully understood; however, the controlling factors are evaluated. The influence of process variables on the nucleation and growth characteristic are illustrated in terms of morphological changes which for example affect the mechanical and tribological properties of a coating. |
