Advanced solutions for 3D integration of heterogeneous individual chips

Autor:	Gilles Poupon
Rok vydání:	2010
Předmět:	Materials science Silicon chemistry business.industry Electrical engineering chemistry.chemical_element System on a chip business Wafer-level packaging
Zdroj:	2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
DOI:	10.1109/impact.2010.5699502
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b56848fb5e364c6994d20408af103a72 https://doi.org/10.1109/impact.2010.5699502 Zobrazit plný text záznamu