Electrocaloric cooling over high device temperature span
| Autor: | Qibing Pei, Yuan Meng, Jun-Hong Pu |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Work (thermodynamics)
Fabrication Materials science Heat regeneration business.industry 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Span (engineering) 01 natural sciences Engineering physics 0104 chemical sciences General Energy Safe operation Electricity Vapor-compression refrigeration 0210 nano-technology Adiabatic process business |
| Zdroj: | Joule. 5:780-793 |
| ISSN: | 2542-4351 |
| DOI: | 10.1016/j.joule.2020.12.018 |
| Popis: | Summary Electrocaloric cooling demonstrates direct electricity utilization and high energy efficiency, and is often proposed as an environmentally benign, solid-state alternative to the conventional vapor compression cooling technology. As a result, the fabrication of effective electrocaloric materials and engineering of electrocaloric cooling devices have attracted increasing attention in the cooling community. However, the limited material adiabatic temperature change under safe operation field poses a major challenge to practical electrocaloric cooling device development, since real-world applications usually require device temperature span over 20 K. This perspective presents recent efforts devoted to design electrocaloric cooling devices based on active heat regeneration and cascading approaches; both strategies have achieved significant device temperature lift ~10 K with adiabatic temperature change of 2~3 K. The strategies discussed in this work are broadly applicable to the design of efficient and compact cooling systems. |
| Databáze: | OpenAIRE |
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