Microstructure of bulk and electroformed Ni implanted with Ti and C
| Autor: | T.A. Christenson, James Arthur Knapp, Michael T. Dugger, Samuel M. Myers, David M. Follstaedt |
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| Rok vydání: | 1998 |
| Předmět: |
Materials science
Metallurgy Alloy Analytical chemistry chemistry.chemical_element Surfaces and Interfaces General Chemistry engineering.material Condensed Matter Physics Microstructure Surfaces Coatings and Films Amorphous solid Nickel Ion implantation Electron diffraction chemistry Transmission electron microscopy Materials Chemistry engineering Titanium |
| Zdroj: | Surface and Coatings Technology. :40-45 |
| ISSN: | 0257-8972 |
| DOI: | 10.1016/s0257-8972(98)00372-7 |
| Popis: | The microstructure of high-purity Ni implanted with overlapping concentration profiles of Ti and C was examined with transmission electron microscopy. An amorphous phase forms at concentrations of 15-18 at.% Ti and 22 at.% C. while a two-phase alloy (amorphous + f.c.c. Ni) forms for |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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