| Autor: |
Dong-Ho Han, Mike Leddige, Jason A. Mix, Daoqiang Lu, Bryce D. Horine, Kent E. Mallory, P.C.H. Meier, M.B. Trobough, Rajashree Baskaran, Victor Prokofiev, Henning Braunisch, James E. Jaussi |
| Rok vydání: |
2006 |
| Předmět: |
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| Zdroj: |
56th Electronic Components and Technology Conference 2006. |
| DOI: |
10.1109/ectc.2006.1645912 |
| Popis: |
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over FR-4 boards by about three times. Active testing results from a 130-nm CMOS test vehicle show the potential of two times higher data rates. The next generation test vehicle with 90-nm CMOS, described briefly, gives improved voltage and timing margins at 20 Gb/s. High-speed connector solutions, especially results from a "split socket" assembly test vehicle, are discussed in detail. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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