Autor: |
Jan Broulim, Vladimir Pavlicek, Ales Krutina, Petr Burian, Stanislav Pospisil, M. Holik, Jan Moldaschl, Vaclav Kraus, Jan Bartovsky, P. Broulím, J. Vlasek, Vjaceslav Georgiev |
Rok vydání: |
2015 |
Předmět: |
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Zdroj: |
2015 23rd Telecommunications Forum Telfor (TELFOR). |
Popis: |
The paper describes a compact system for detecting Single Event Effects (SEE) in semiconductor components. The SEE is caused by a hit into a electronic chip with an energetic particle. The hit can cause unexpected behaviour of the system. The tested component is called Device Under Test (DUT). The structure of the system is shown and used components are described with their main tasks. Some of results of the running system are shown. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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