Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure

Autor:	Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen, Mu-Ping Hsu, Han-Wen Hu, Tai-Yu Lin, Ying-Chan Hung, Kuan-Neng Chen
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Electron Device Letters. 44:492-495
ISSN:	1558-0563 0741-3106
DOI:	10.1109/led.2023.3239011
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b3db55874e4728f36da99a76a917edac https://doi.org/10.1109/led.2023.3239011 Zobrazit plný text záznamu