| Autor: |
J. A. Robo, David Gohier, Alain Manissadjian, Odile Huet, Lydie Dua, Philippe Bois, Alexandru Nedelcu, Nadia Brière de l’Isle, Xavier Marcadet, Eric Costard, Jean P. Truffer |
| Rok vydání: |
2007 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
Since 2002, the THALES Group has been manufacturing sensitive arrays using QWIP technology based on GaAs and related III-V compounds, at THALES Research and Technology Laboratory. The QWIP technology allows the realization of large staring arrays for Thermal Imagers (TI) working in the long-wave infrared (LWIR) band (8-12 μm). In the past researchers claimed many advantages of QWIPs. Uniformity was one of these and has been the key parameter for the production to start. The 640x512 LWIR focal plane arrays (FPAs) with 20μm pitch was the demonstration that state of the art performances can be achieved even with small pixels. This opened the field for the realization of usable and affordable megapixel FPAs. Thales Research & Technology (TRT) has been developing third generation GaAs LWIR QWIP arrays for volume manufacture of high performance low cost thermal imaging cameras. In the past, another widely claimed advantage for QWIPs was the so-called band-gap engineering and versatility of the III-V processing allowing the custom design of quantum structures to fulfil the requirements of specific applications such as very long wavelength (VLWIR) or multispectral detection. In this presentation, we present the performances of both our first 384x288, 25 μm pitch, MWIR (3-5μm) / LWIR (8-9 μm) dual-band FPAs, and the current status of QWIPs for MWIR ( 15μm) arrays. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
