Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance

Autor:	Yair Ein-Eli, Magi Margalit Nagar, Jan Vaes
Rok vydání:	2010
Předmět:	Potassium sorbate Stereochemistry General Chemical Engineering chemistry.chemical_element Polishing Surface finish Copper chemistry.chemical_compound chemistry Chemical engineering Chemical-mechanical planarization Electrochemistry Slurry Surface roughness Solubility
Zdroj:	Electrochimica Acta. 55:2810-2816
ISSN:	0013-4686
DOI:	10.1016/j.electacta.2009.10.086
Popis:	This study reports on the effects of potassium sorbate (K[CH 3 (CH) 4 CO 2 ]) on copper chemical mechanical planarization (CMP) performance and demonstrates how the performance can be controlled by the inhibitor concentration in the slurry. The study is a continuation of a recent report on the copper polishing mechanism in H 2 O 2 /glycine-based slurries using sorbate as an inhibitor. CMP performance with respect to the inhibitor concentration in the slurry is evaluated in terms of surface roughness, polishing uniformity and dishing values. CMP results obtained from blanket wafers show that an increased sorbate concentration provides lower roughness values. CMP data obtained from patterned wafers shows that an increased sorbate concentration provides better polishing uniformity and lower dishing values for copper lines. The high solubility of sorbate in water (up to 9 M) is a major advantage for CMP processing.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b3852e504617b3d53010adcc21412e38 https://doi.org/10.1016/j.electacta.2009.10.086 Zobrazit plný text záznamu Full Text from ScienceDirect