Thin-Film Deposition With Refractory Materials Using a Vacuum Arc

Autor: Raymond L. Boxman, D. Arbilly, Isak I. Beilis, Yefim Yankelevich, Y. Koulik
Rok vydání: 2015
Předmět:
Zdroj: IEEE Transactions on Plasma Science. 43:2323-2328
ISSN: 1939-9375
0093-3813
DOI: 10.1109/tps.2015.2432577
Popis: Refractory metal plasma generated by a vacuum arc was used to deposit thin films with different arc currents $I$ . The deposition rate $V_{\rm dep}$ was measured for electrode configurations including a planar Zr cathode and a planar W anode; cylindrical W or Mo electrode pairs and a cylindrical Nb cathode closed by a BN plate and a W or Nb shower-head cup anode or with one-hole Ta cup anode. $V_{\rm dep}$ for a Mo electrode pair with $I=275$ A at a distance $L=110$ mm from the electrode axis reached 2.2 $\mu \text{m}$ /min, 60 s after arc ignition. For the W electrode pair $V_{\rm dep}$ was $\sim 1\mu \text{m}$ /min at 80 s ( $I=200$ A and $L=110$ mm), while for W film deposition with shower-head anode $V_{\rm dep}$ was $\sim 0.6\mu \text{m}$ /min ( $I=200$ A and $L=60$ mm). For Nb films deposited with the closed electrode configuration, $V_{\rm dep}$ was 0.3 $\mu \text{m}$ /min at 30 s after arc ignition ( $I=275$ A and $L=80$ mm from the anode front).
Databáze: OpenAIRE