An Optimized Via Contact Scheme of FeRAM for Double-Level Metallization and Beyond
Autor: | Mi-Hyang Lee, N.J. Kang, Jinwoo Lee, Kinam Kim, Yoo-Sang Hwang, Yoon-Soo Chun, Sung-Yung Lee, Sang-eun Lee, Dong-won Shin, Bon-jae Koo, Soo-Ho Shin, Byung-Hee Kim, Dong-Jin Jung |
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Rok vydání: | 1997 |
Předmět: | |
Zdroj: | Extended Abstracts of the 1997 International Conference on Solid State Devices and Materials. |
DOI: | 10.7567/ssdm.1997.b-1-3 |
Databáze: | OpenAIRE |
Externí odkaz: |