| Autor: |
Mohamed Mehdi Jatlaoui, Mickael Pommier, Charles Muller |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). |
| DOI: |
10.1109/ltb-3d53950.2021.9598388 |
| Popis: |
Low temperature solders usage for broadband assemblies represent an important challenge for the industry. Using lower temperatures for reflow subsequently shows less deformation on mother boards used for optical sub-assemblies and then less RF parasitics. However, some parts in optical sub-assemblies, like laser diodes, require good thermal dissipation to work properly and avoid unwanted modulations. This work will present an innovative way to use SnBi (Tin-Bismuth) eutectic alloy to assemble an integrated capacitive Silicon interposer on top of which a laser diode can be assembled as well. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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