Observation of radiation induced changes in stress and electrical properties in MOS devices
Autor: | K.P. MacWilliams, D.C. Shaw, C.E. Barnes, L. Lowry |
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Rok vydání: | 1992 |
Předmět: | |
Zdroj: | IEEE Transactions on Nuclear Science. 39:2146-2151 |
ISSN: | 1558-1578 0018-9499 |
DOI: | 10.1109/23.211415 |
Popis: | Strain measurements using X-ray diffraction were performed on irradiated commercial and radiation-hardened metal gate CMOS devices in addition to polysilicon gate NMOS devices. I-V curves were taken and V/sub ot/ and V/sub it/ were separated using the subthreshold slope method for all devices. A correlation has been shown to exist between physical strain relaxation and the electrical properties as a function of radiation dose and recovery. Data shown suggest that the physical response (strain relaxation) in the silicon at the oxide interface is a measure of the type of damage induced and the recovery mechanism. Postradiation measurements of triangle V/sub it/ and triangle V/sub ot/ taken immediately after irradiation support the conclusions of V. Zekeriya and T.-P. Ma (1983) and K. Kasama et al. (1986,1987); compressive stress at the silicon/SiO/sub 2/ interface does reduce radiation damage in the device. > |
Databáze: | OpenAIRE |
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