| Autor: |
Mei-Jiau Huang, Zheng-Zhun Chen, Heng-Chieh Chien |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA). |
| DOI: |
10.1109/vlsi-tsa48913.2020.9203733 |
| Popis: |
This paper describes a non-simulation method to determine the thermal performance of a package structure. This method uses a methodology, we called layer-by-layer solving method, which can quickly solve the thermal resistance of the entire package architecture and the laminated structures inside the package. Because using analytical solutions, this method can accelerate the solving time to within 2 seconds, while the accuracy is about 3% compared to the simulation technique. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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