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The influence of solution treatment on microstructure evolution and mechanical behavior of Cu-20Ni-20Mn alloy was investigated by optical microscopy (OM), X-ray diffraction (XRD) and hardness test. The results revealed that both solution temperature and holding time had effect on the grain growth behavior. The grain growth activation energy was determined by grain size of Cu-20Ni-20Mn alloy for different heat treatment temperatures and periods. With increasing temperature of solution treatment, the second phase is gradually dissolved into the Cu-rich matrix, and the lattice parameter of the matrix solution treated at 1173K for 0.5 h was about 3.668 Å. The hardness of the solution-treated alloy was lower than that of hot forging, and the hardness value decreased with the increase of solution temperature, which may be attributed to grain size. The hardening ability, corresponding to the Hall-Petch relationship, decreased linearly with D-1/2. |
