Investigations of solution variables in a contactless copper electrodeposition process for 3D packaging applications

Autor:	Farhang Shadman, Zach Patterson, Steven Verhaverbeke, Rajesh Balachandran, Manish Keswani, Mingrui Zhao, Roman Gouk, C. Weber
Rok vydání:	2015
Předmět:	Materials science Supporting electrolyte Mechanical Engineering Metallurgy chemistry.chemical_element Condensed Matter Physics Electrochemistry Copper chemistry Mechanics of Materials Copper plating Deposition (phase transition) General Materials Science Wafer Current (fluid) Current density
Zdroj:	Materials Science in Semiconductor Processing. 30:578-584
ISSN:	1369-8001
DOI:	10.1016/j.mssp.2014.10.046
Popis:	A novel electrochemical method for contactless electrodeposition of copper onto silicon wafers has been investigated. Deposition parameters such as applied current, concentrations of deposition solution and supporting electrolyte were optimized to achieve high deposition rates as well as homogenous deposition of copper. Copper sulfate solution temperature of about 65 °C was shown to be suitable for achieving stable and high values of current density that translated to copper deposition rates of~2.4 µm/min with good deposition uniformity.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b1c11141a5f933ba364c7d907b571a98 https://doi.org/10.1016/j.mssp.2014.10.046 Zobrazit plný text záznamu Full Text from ScienceDirect