Full wafer OCD metrology: increasing the sampling rate without the cost of ownership penalty

Autor:	Daniel R. Doutt, Ping-ju Chen, Bhargava Ravoori, Tuyen K. Tran, Eitan Rothstein, Nir Kampel, Lilach Tamam, Effi Aboody, Avron Ger, Hari Vedala
Rok vydání:	2023
Zdroj:	Metrology, Inspection, and Process Control XXXVII.
DOI:	10.1117/12.2657471
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b1a705fb88f99924f6d148804f1aed1e https://doi.org/10.1117/12.2657471 Zobrazit plný text záznamu