Cost-effective Use of Gold Wire in Semiconductor Packaging
| Autor: | Charles J. Vath, Richard Holliday |
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| Rok vydání: | 2011 |
| Předmět: | |
| Zdroj: | ECS Transactions. 34:843-855 |
| ISSN: | 1938-6737 1938-5862 |
| DOI: | 10.1149/1.3567682 |
| Popis: | The semiconductor industry has maintained an average 15% cost down per year over the range of products it offers. Continued cost reduction will be difficult to achieve based on current practices and raw material prices. The need to remain competitive has compelled integrated device manufacturers and subcontractors to look at alternative material types, most notably copper wire. A recent survey of the industry has revealed that there remain very widespread concerns on migrating away from the use of gold. It is important that the cost of using gold wire is minimized without compromising on product reliability and quality. We present a critical review of the wire bonding process focusing on various practices, procedures, and material choices. Such analyses indicate, for example, that a reduction of the FAB ratio in a 32 I/O QFN with 38 wires from 2 to 1.4, would save 1 km per 1,100 strips. |
| Databáze: | OpenAIRE |
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