Phase Field Simulation of Electromigration-induced Failure in TSV Interconnect

Autor:	Xin Zeng, Zhiheng Huang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
DOI:	10.1109/icept56209.2022.9873120
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b19724984d02804cd019bbe67cdef5c4 https://doi.org/10.1109/icept56209.2022.9873120 Zobrazit plný text záznamu