| Autor: |
L. Berla, S. Panzer, M. Mehlman, M. Costley, D. Rolfe, E. Lau |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 IEEE Symposium on Product Compliance Engineering (ISPCE). |
| Popis: |
Various readily available powdered materials were examined in order to determine their usefulness for removal of common electrical potting materials via microabrasive media blasting. Each blasting media was tested against five different potting materials, and was additionally characterized in terms of mechanical and triboelectric properties. Additional work has been cited that lends credence to the empirical observations found herein. In summary, of the materials tested, only baker's sugar appears to be a suitable candidate for removal of the tested potting materials on sensitive electrical printed circuit board assemblies. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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