A solid state bonding technology for metal plate by shear-extrusion and the analysis of microstructure and bonding strength

Autor: Shibo Ma, Qiang Li, Lishi Jiao, Wei Wang, Shuangjie Zhang, Huajun Yan
Rok vydání: 2020
Předmět:
Zdroj: Journal of Manufacturing Processes. 59:477-486
ISSN: 1526-6125
DOI: 10.1016/j.jmapro.2020.09.055
Popis: A shear-extrusion bonding (SEB) technology is developed for the bonding of metal plates with the background of endless hot rolling of strip steel. Two key process parameters, deformation ratio and deformation rate, are analyzed by experiments using Q345 steel from the perspective of microstructure and bonding strength. The main findings are: (i) With increasing deformation ratio, the width of bonding interface gradually decreased and the refined grains on both sides of the bonding interface are found. When the deformation ratio is below 75 %, the deformation rate has a significant influence on the closure of holes. The width of bonding interface is smaller at a low deformation rate. However, no obvious difference is found in terms of grain refinement degree. Nevertheless, when the deformation ratio reached 100 %, the grains on both sides of the bonding interface are finer at low deformation rate. When the deformation ratio increased to 150 %, an excellent bonding can be obtained. (ii) In terms of bonding strength, as deformation ratio increases, the plasticity of specimens tends to increase whether at low or high deformation rate. Interestingly, the plasticity property of processed specimens can precede the raw material when the deformation ratio reaches 125 % at low deformation rate. When the deformation ratio reaches 125 % at low deformation rate or 100 % at high deformation rate, the bonding strength can reach the tensile strength of the raw material.
Databáze: OpenAIRE