3D IC assembly using thermal compression bonding and wafer-level underfill — Strategies for quality improvement and throughput enhancement
| Autor: | Fabrice Duval, Pieter Bex, Giovanni Capuz, Kenneth June Rebibis, Teng Wang, Keiichi Hatakeyama, Masanori Natsukawa, Julien Bertheau, Andy Miller, Fumihiro Inoue, Carine Gerets, Eric Beyne, Gerald Beyer, Kazuyuki Mitsukura |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Engineering drawing Materials science 020208 electrical & electronic engineering Electronic packaging Stacking Three-dimensional integrated circuit 02 engineering and technology Temperature cycling Thermocompression bonding 01 natural sciences 0103 physical sciences Compatibility (mechanics) 0202 electrical engineering electronic engineering information engineering Wafer Composite material Flip chip |
| Zdroj: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). |
| Popis: | This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pre-assembly and assembly process steps. And all the process steps after and including WLUF lamination have to be co-optimized to ensure the integrity of the WLUF material, consequently leading to higher stacking yield. Good bump joining and underfill filling quality is achieved by optimization different stages of the TCB profiles. A new method enabled by WULF, termed vertical collective bonding (VCB), is applied to multi-layer 3D stacking, producing good bonding quality and significant process time saving. Multi-layer 3D stacks made by the VCB process show good thermomechanical reliability in high temperature storage and thermal cycling tests. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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