Electron beam welding of copper using plasma spraying for filler metal deposition
| Autor: | Maximilian Stummer, Adrian Aumayr, Markus Stütz, Norbert Enzinger |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Filler (packaging) Materials science Filler metal business.industry Mechanical Engineering Metallurgy Metals and Alloys chemistry.chemical_element Atmospheric-pressure plasma 02 engineering and technology Welding 021001 nanoscience & nanotechnology 01 natural sciences Copper Steelmaking law.invention chemistry Mechanics of Materials law 0103 physical sciences Electron beam welding 0210 nano-technology business Penetration depth |
| Zdroj: | Welding in the World. 62:1341-1350 |
| ISSN: | 1878-6669 0043-2288 |
| Popis: | Due to physical properties like high thermal and electrical conductivity, joining of copper is of special interest in steelmaking or electrical industry. Unfortunately, joining of thick-walled copper components using electron beam welding (EBW) tends to welding defects like insufficient root formation or varying penetration depth. In previous investigations, Cu-DHP (deoxidised high phosphorus copper) plates were successfully joined by EBW utilising a CuSn6 sheet as filler material. The investigation resulted in a stable EBW parameter window. Nevertheless, using CuSn6 sheets lead to challenges concerning joint preparations, and is not usable for arbitrary weld configurations. To meet these challenges, atmospheric plasma spraying (APS) is used to apply a thin interlayer in the welding zone and substitute the CuSn6 sheet filler metal. This continuative work includes further improvements of the main EBW parameters and uses APS as a new approach for filler metal deposition. Furthermore, determining and enhancing the service properties of the copper joints is of main interest and reported here. |
| Databáze: | OpenAIRE |
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