Design and simulation of a novel flip-chip structure for THz detector package
| Autor: | Xin Lv, Cheng Lifeng, Zhen Tang, Haidong Hao, Hongda Lu |
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| Rok vydání: | 2016 |
| Předmět: |
Wire bonding
FEKO Materials science business.industry Terahertz radiation 020208 electrical & electronic engineering Schottky diode 020206 networking & telecommunications 02 engineering and technology Condensed Matter Physics Electronic Optical and Magnetic Materials Camera lens Printed circuit board Optics Hardware and Architecture 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Antenna (radio) business Flip chip |
| Zdroj: | Microsystem Technologies. 23:2759-2766 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-016-3021-1 |
| Popis: | This work is intended to describe the design aspects and to characterize the functionality of a novel flip-chip (FC) structure applicable for THz camera assembling. The proposed FC structure consists of a thin-film ceramic layer sandwiched between a GaAs substrate and PCB board. There is an air chamber underneath the antenna to protect the air bridge of Schottky Diode located on GaAs substrate and improve antenna performance. In particular, we have used the novel FC structure simulation result as the excitation source for THz camera lens simulation. Even if the FC structure cause antenna performance to deteriorate, the high gain can be obtained at 0.34 THz and 0.22 THz (λ = 880 and 1360 μm) from the FEKO simulation results. The FC structure mode and the without FC structure (wire bonding structure) mode were characterized using same test system, they show good match in proposed frequency range. |
| Databáze: | OpenAIRE |
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