Autor:	Seiya Hagihara, Yutaka Hayama, Masaaki Koganemaru, Noriyuki Miyazaki, Tomoki Sakaguchi, Nobuyuki Shishido
Rok vydání:	2021
Předmět:	Computer science Power module Structural integrity Electrical and Electronic Engineering Reliability engineering Test (assessment)
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 24:560-571
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.jiep-d-21-00004
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b14eef893cc2c1b2b153a53bfe1541f3 https://doi.org/10.5104/jiep.jiep-d-21-00004 Zobrazit plný text záznamu