Modelling of heat transfer in waterjet guided laser drilling of silicon

Autor:	D B Johnson, R Kovacevic, C-F Li
Rok vydání:	2003
Předmět:	Materials science Silicon Mechanical Engineering Mechanical engineering Drilling chemistry.chemical_element Substrate (electronics) Industrial and Manufacturing Engineering chemistry Thermal Heat transfer Degree of precision Laser processing Laser drilling
Zdroj:	Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 217:583-600
ISSN:	2041-2975 0954-4054
DOI:	10.1243/095440503322011326
Popis:	Waterjet guided laser processing is an internationally patented technique based on guiding a laser beam inside a thin, high-speed waterjet. The process combines the advantages of laser processing with those of waterjet cutting. It is very suitable in processing thin and heat-sensitive materials with a high degree of precision required. A model and simulation method for waterjet guided laser drilling on a silicon substrate are presented in this study. A finite difference method has been developed to simulate the thermal field and phase changes involved. The model represents the thermal process in detail. The simulation results predict the main characteristics of waterjet guided laser drilling. The study gives insight into the interactions between the laser beam, waterjet and workpiece material during drilling of a silicon substrate.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b113e6790f05621bb2ca80c84fa02a7e https://doi.org/10.1243/095440503322011326 Zobrazit plný text záznamu