SIPI co-extraction and SPICE co-simulation for package on-die decap optimization
| Autor: | Antonio Ciccomancini Scogna, LianKheng Teoh |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
030222 orthopedics
Engineering business.industry Noise (signal processing) Spice SIGNAL (programming language) Hardware_PERFORMANCEANDRELIABILITY Solid modeling Co-simulation Die (integrated circuit) Power (physics) 03 medical and health sciences 0302 clinical medicine Hardware_INTEGRATEDCIRCUITS Scattering parameters Electronic engineering business 030217 neurology & neurosurgery Computer hardware |
| Zdroj: | 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI). |
| DOI: | 10.1109/sapiw.2016.7496273 |
| Popis: | SIPI co-simulation is common practice for simultaneous switching noise (SSN) analysis at system level including PCB, package and die. However, SPICE models of the signal nets and the power delivery network (PDN) are usually separately extracted. A SIPI co-extraction methodology is proposed and applied to a DDR3 memory interface. A simplified SPICE model is introduced by scaling the signal nets toggling activities and efficient on-die optimization for on-chip and package co-design workflow is enabled. |
| Databáze: | OpenAIRE |
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