Direct On-Chip 3-D Aerosol Jet Printing With High Reliability
| Autor: | Xuejun Lu, Xing Lan, Rich Lai, Evan Nguyen, Maggie Yihong Chen, Jesse Tice, Thomas Chung, Dan Scherrer |
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| Rok vydání: | 2017 |
| Předmět: |
Engineering
Fabrication business.industry 020208 electrical & electronic engineering 020206 networking & telecommunications Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Integrated circuit Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials law.invention Reliability (semiconductor) Semiconductor law Logic gate Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering System on a chip Electrical and Electronic Engineering business Microwave Monolithic microwave integrated circuit |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1369-1376 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2017.2710957 |
| Popis: | We demonstrate a new, low-cost, additive aerosol jet (AJ) printing fabrication method for 3-D on-chip interconnects on III–V semiconductor chips. A dielectric layer and bridge-type gold interconnects were printed on a GaAs-based microwave monolithic integrated circuit (MMIC) to connect a gate pad and a ground pad of the MMIC. The MMICs with the printed 3-D interconnects show the same RF performance as those tested before printing with the gate voltage biased at 0 V. This indicates that the 3-D printed interconnects can provide effective and reliable connections. Extensive reliability tests including thermal shock, thermal cycle, and current stress tests were performed on the MMIC with the printed 3-D interconnects. No performance degradation was found after the reliability tests. The performance and reliability study demonstrates that the low-cost, additive 3-D AJ printing is an effective fabrication method for adding highly reliable on-wafer circuit functionalities and features. Additive printing is an excellent complementary technology to existing semiconductor technologies for instantaneous on-wafer circuit prototyping, repair, tuning, reconfiguration, and system on-chip integration with high reliability. |
| Databáze: | OpenAIRE |
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