The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules
| Autor: | A.J. Staniszewski, Jeffrey A. Prentice, G.-W. Pan, Barry K. Gilbert, S.K. Zahn, W.L. Walters |
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| Rok vydání: | 1992 |
| Předmět: |
Digital electronics
Very-large-scale integration Engineering business.industry General Engineering Electromagnetic compatibility Integrated circuit computer.software_genre Industrial and Manufacturing Engineering Microstrip Electronic Optical and Magnetic Materials law.invention Transmission line law Electronic engineering Computer Aided Design Electrical and Electronic Engineering business computer Stripline |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:465-477 |
| ISSN: | 0148-6411 |
| DOI: | 10.1109/33.159875 |
| Popis: | The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e. mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages. > |
| Databáze: | OpenAIRE |
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