Electrochemical deposition of Ag–Sn alloys onto copper and titanium plates
| Autor: | M. S. Mikhailova, V. M. Roshchin, I. N. Petukhov, Yu. I. Shilyaeva, V. A. Fedorov |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science General Chemical Engineering Metallurgy Alloy Metals and Alloys chemistry.chemical_element 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Electrochemistry 01 natural sciences Copper Inorganic Chemistry Differential scanning calorimetry chemistry 0103 physical sciences Materials Chemistry engineering Deposition (phase transition) 0210 nano-technology Titanium |
| Zdroj: | Inorganic Materials. 52:1220-1223 |
| ISSN: | 1608-3172 0020-1685 |
| DOI: | 10.1134/s0020168516110091 |
| Popis: | In this paper, we report a detailed study of the thermal properties of a peritectic Ag–Sn alloy electrochemically deposited onto copper and titanium plates in order to produce soldered contact structures. A comparative analysis of Ag and Sn codeposition and layer-by-layer deposition processes is presented. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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