| Autor: |
Hsiao Chin Tuan, Chun-Wen Cheng, Chia-Hua Chu, Weileun Fang, Jiou-Kang Lee, Kai-Chih Liang, Alex Kalnitsky, David A. Horsley, Chung-Hsien Lin, Te-Hao Lee |
| Rok vydání: |
2012 |
| Předmět: |
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| Zdroj: |
2012 IEEE Sensors. |
| DOI: |
10.1109/icsens.2012.6411212 |
| Popis: |
A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum level because all material can be high temperature annealed before final encapsulation. This study also demonstrated some MEMS devices using this new scheme, including resonators, accelerometers and magnetometers. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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