Modular test system architecture for device, circuit and system level reliability testing
| Autor: | Klaus Krischan, Sascha Einspieler, Roland Sleik, Michael Glavanovics, Annette Muetze |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Engineering business.industry 020208 electrical & electronic engineering 02 engineering and technology Modular design Stress testing (software) 01 natural sciences Reliability engineering Test (assessment) Data acquisition Reliability (semiconductor) 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Systems architecture Device under test business Highly accelerated life test |
| Zdroj: | 2016 IEEE Applied Power Electronics Conference and Exposition (APEC). |
| DOI: | 10.1109/apec.2016.7467957 |
| Popis: | Reliability stress testing of power semiconductors requires significant development effort for a test apparatus to provide the required functionality. This paper presents a modular test system architecture which focuses on flexibility, reusability and adaptability to future test requirements. Different types of tests for different devices in application circuit configuration can be implemented based on the same modular test system concept. Vital parameters of the device under test (DUT) can be acquired in situ during the running stress test. This enables to collect drift data of this parameters. The control and data acquisition parts of the test system are separated from the actual test circuit. With this physical separation, the same control part can be used for different types of tests. Experimental results of a prototype test system are provided. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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