Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Autor:	Meiling Xin, Xiuqi Wang, Fenglian Sun
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Materials Science: Materials in Electronics. 33:25025-25040
ISSN:	1573-482X 0957-4522
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b0370910c7ff7b726f1944b1bdfc7747 https://doi.org/10.1007/s10854-022-09210-9 Zobrazit plný text záznamu Full text from SpringerLink