Effects of partially broken HF signal return on different packaging levels

Autor:	T. Gneiting, Roland Frech, T.-M. Winkel
Rok vydání:	2008
Předmět:	Coupling Electromagnetic field Materials science Acoustics Multi-chip module Electronic engineering Electronic packaging Time domain Signal integrity Classification of discontinuities Signal
Zdroj:	2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
DOI:	10.1109/epep.2008.4675928
Popis:	Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structures are analysed using 3D field calculations. Resulting coupling effects were calculated and also verified with time domain measurements. The results are discussed with respect to the impact on signal integrity.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b01b4b1007b1b2b11d2d5b27c276b3b3 https://doi.org/10.1109/epep.2008.4675928 Zobrazit plný text záznamu