Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications
| Autor: | Mathias Nowottnick, Andrej Novikov |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Test bench
Materials science Computer Networks and Communications Metallurgy Alloy Intermetallic Mixing (process engineering) Solder paste chemistry.chemical_element engineering.material Copper Electronic Optical and Magnetic Materials chemistry Soldering engineering Thermal stability Electrical and Electronic Engineering |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 15:35-40 |
| ISSN: | 1551-4897 |
| Popis: | New technology based on mixing of standard alloy SnCu in form of solder paste with copper paste was presented. This technology allows the production of solder joints with higher standoff consisting of intermetallic compounds. Such solder joints were qualified for high temperature applications by investigation of thermal stability of overlapped solder joints. For this purpose a special test bench for the investigation of remelting temperature up to 300°C was developed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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