Engineering Electrical Interfaces to Silicon via Indium Solder

Autor: Robert M. Panas, Martin L. Culpepper
Rok vydání: 2015
Předmět:
Zdroj: IEEE Transactions on Electron Devices. 62:1977-1983
ISSN: 1557-9646
0018-9383
Popis: This paper provides engineering models of a simple and robust approach for creating electrical connections to silicon using reduced temperature ( $\approx 1\Omega $ -cm $^{2}$ for $\langle 110\rangle $ p-type wafers at $10^{17}$ cm $^{-3}$ doping.
Databáze: OpenAIRE