Engineering Electrical Interfaces to Silicon via Indium Solder
Autor: | Robert M. Panas, Martin L. Culpepper |
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Rok vydání: | 2015 |
Předmět: | |
Zdroj: | IEEE Transactions on Electron Devices. 62:1977-1983 |
ISSN: | 1557-9646 0018-9383 |
Popis: | This paper provides engineering models of a simple and robust approach for creating electrical connections to silicon using reduced temperature ( $\approx 1\Omega $ -cm $^{2}$ for $\langle 110\rangle $ p-type wafers at $10^{17}$ cm $^{-3}$ doping. |
Databáze: | OpenAIRE |
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