56‐2: Thin Foldable AMOLED Module with Excellent Low‐Temperature‐Bendability and Pencil Hardness
Autor: | Edward Andrew Boardman, Yasuyuki Togashi, Takehiro Murao, Yamada Miho, Ryo Kikuchi, Tim Michael Smeeton, Kenichiro Tsuchida, Masahiro Hasegawa, Akira Sakai, Yuki Yasuda, Noriko Watanabe |
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Rok vydání: | 2020 |
Předmět: | |
Zdroj: | SID Symposium Digest of Technical Papers. 51:830-833 |
ISSN: | 2168-0159 0097-966X |
DOI: | 10.1002/sdtp.13998 |
Databáze: | OpenAIRE |
Externí odkaz: |