56‐2: Thin Foldable AMOLED Module with Excellent Low‐Temperature‐Bendability and Pencil Hardness

Autor: Edward Andrew Boardman, Yasuyuki Togashi, Takehiro Murao, Yamada Miho, Ryo Kikuchi, Tim Michael Smeeton, Kenichiro Tsuchida, Masahiro Hasegawa, Akira Sakai, Yuki Yasuda, Noriko Watanabe
Rok vydání: 2020
Předmět:
Zdroj: SID Symposium Digest of Technical Papers. 51:830-833
ISSN: 2168-0159
0097-966X
DOI: 10.1002/sdtp.13998
Databáze: OpenAIRE