Low-Temperature Drop-on-Demand Reactive Silver Inks for Solar Cell Front-Grid Metallization
| Autor: | Laura Ding, Avinash Mamidanna, Owen Hildreth, Mariana I. Bertoni, April M. Jeffries |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Amorphous silicon
Fabrication Materials science Nanotechnology 02 engineering and technology Conductivity 010402 general chemistry 01 natural sciences law.invention chemistry.chemical_compound law Photovoltaics Thermal Solar cell Electrical and Electronic Engineering Electrical conductor Equivalent series resistance business.industry 021001 nanoscience & nanotechnology Condensed Matter Physics 0104 chemical sciences Electronic Optical and Magnetic Materials chemistry Optoelectronics 0210 nano-technology business |
| Zdroj: | IEEE Journal of Photovoltaics. 7:37-43 |
| ISSN: | 2156-3403 2156-3381 |
| Popis: | Formation of high-conductivity metal contacts at low temperatures expands optoelectronic device opportunities to include thermally sensitive layers, while reducing expended thermal budget for fabrication. This includes high-efficiency silicon heterojunction solar cells with intrinsic amorphous silicon layers. Efficiencies of these cells are limited by series resistance; the primary cause of this is the relatively high resistivity of the low-temperature silver paste used to form front-grid metallization. In this paper, we report the formation of highly conductive features by drop-on-demand printing of reactive silver ink (RSI) at a low temperature of 78 °C, resulting in media resistivities of 3–5 μΩ·cm. When used as a front grid on a silicon heterojunction solar cell, RSI fingers give cell series resistance of 1.8 Ω·cm2 (without optimization of the process), which is impressively close to 1.1 Ω·cm2 for our commercially available screen-printed low-temperature silver paste metallization. We present here the promising first results of RSI as metallic finger for photovoltaics, which upon optimization of design parameters has the potential to outperform the screen-printed low-temperature silver paste counterpart. |
| Databáze: | OpenAIRE |
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