High-Temperature and Anodic Oxidation of Thin NiSi and NiSi2 Films
Autor: | A. S. Dranenko, V. N. Talash, M. V. Koshelev, Vladimir A. Lavrenko |
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Rok vydání: | 2014 |
Předmět: |
Materials science
Mass increment Silicon Anodic oxidation Metals and Alloys chemistry.chemical_element Condensed Matter Physics Electrochemical corrosion chemistry.chemical_compound Chemical engineering chemistry Mechanics of Materials Metallic materials Silicide Materials Chemistry Ceramics and Composites Thin film Stoichiometry |
Zdroj: | Powder Metallurgy and Metal Ceramics. 52:572-576 |
ISSN: | 1573-9066 1068-1302 |
DOI: | 10.1007/s11106-014-9562-x |
Popis: | The high-temperature and anodic oxidation of thin NiSi and NiSi2 films produced by thermal annealing of Ni film on single-crystalline silicon is studied. Both types of oxidation lead to the formation of thin protective SiO2 layers. The high-temperature oxidation of NiSi films begins at 930 K, which is 100 K lower than that of NiSi2 films. When temperature increases, the mass increment of NiSi films becomes greater than that of NiSi2 films. This difference is three times as great at 1273 K, which is due to the difference in structure and stoichiometry. It is shown that the electrochemical corrosion resistance of films increases from Ni to NiSi and to NiSi2. |
Databáze: | OpenAIRE |
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