Multi-pulsed flash light sintering of copper nanoparticle pastes on silicon wafer for highly-conductive copper electrodes in crystalline silicon solar cells
Autor: | Il-Hyoung Jung, Yong-Rae Jang, Hyun-Jun Hwang, Dug-Joong Kim, Yeon-Taek Hwang, Hak-Sung Kim |
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Rok vydání: | 2018 |
Předmět: |
Materials science
business.industry General Physics and Astronomy Sintering chemistry.chemical_element Nanoparticle 02 engineering and technology Surfaces and Interfaces General Chemistry Substrate (electronics) 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Copper 0104 chemical sciences Surfaces Coatings and Films chemistry Electrode Optoelectronics Wafer Crystalline silicon 0210 nano-technology business Electrical conductor |
Zdroj: | Applied Surface Science. 462:378-386 |
ISSN: | 0169-4332 |
DOI: | 10.1016/j.apsusc.2018.08.098 |
Popis: | In this work, ultra-high speed flash white light (FWL) sintering method of copper nanoparticle pastes on silicon wafer substrate, was developed to produce highly conductive and low-cost copper electrodes for crystalline silicon solar cells. FWL sintering of copper nanoparticles on silicon wafer substrate has been regarded to be very difficult, due to its high thermal conductivity (k) compared with that of polymer (PI and PET) substrates. To overcome this limitation, we applied multiple pulsed FWL to sinter copper nanoparticles (Cu NPs) printed on silicon wafer. Furthermore, bimodal Cu NPs with different size were also applied to enhance the packing density of Cu films for highly conductive Cu electrodes. Finally, this work demonstrated that Cu NP-pastes are successfully sintered on crystalline silicon wafer substrate by multiple pulsed FWL irradiations. |
Databáze: | OpenAIRE |
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