Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S

Autor:	A. Val, Patrick Poirier, Charles Regard, P. Schwindenhammer, Hélène Fremont, F. Roullier, Christian Gautier
Rok vydání:	2008
Předmět:	Wafer-scale integration Materials science Chip-scale package Soldering Ball grid array Electronic packaging Electronic engineering Mechanical engineering Temperature cycling Wafer-level packaging Flip chip
Zdroj:	EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
DOI:	10.1109/esime.2008.4525100
Popis:	In this paper the solder fatigue of WLCSP (wafer level chip scale packages) assemblies is studied and a comparison with flip chip BGA is made. Previous works have already shown that for BGA, the most critical parameters are size, thickness, and underfill. We have evaluated both by thermal cycling and by simulations the effect of thickness and underfill in the WLCSP's case. WLCSP devices with a size of 13mm2 were stressed up to 1500 cycles to emphasize the BGA like failures and evaluate the behavior of this new technology. We have demonstrated that the same failure mechanisms occur in BGA and in WLCSP. We also highlight the criticality of the WLCSP regarding industrial assembly process on board.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::aea5b3758af4cf4de14b4b981152ab8d https://doi.org/10.1109/esime.2008.4525100 Zobrazit plný text záznamu