Electroless Copper Deposition Using Fe (II) Complex as a Reducing Agent

Autor:	Saito Makoto, Yuichi Sato, Koichi Kobayakawa, Michinari Sone
Rok vydání:	2002
Předmět:	Materials science Reducing agent Metallurgy General Engineering Copper plating Copper deposition
Zdroj:	Journal of the Surface Finishing Society of Japan. 53:559-560
ISSN:	1884-3409 0915-1869
DOI:	10.4139/sfj.53.559
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ae9642452ffe97bbad1b474974052857 https://doi.org/10.4139/sfj.53.559 Zobrazit plný text záznamu