Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

Autor:	Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
Rok vydání:	2022
Předmět:	Biomaterials Metals and Alloys Ceramics and Composites Surfaces Coatings and Films
Zdroj:	Journal of Materials Research and Technology. 19:2510-2515
ISSN:	2238-7854
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ae6adf01da27f672fe55542c55d21687 https://doi.org/10.1016/j.jmrt.2022.06.030 Zobrazit plný text záznamu