Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process
| Autor: | Li-Chun Chen, Henry J. H. Chen, Chenhsin Lien, Shou-Ren Chen, Yu-Lun Ho |
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| Rok vydání: | 2008 |
| Předmět: |
Materials science
Nanowire Nanotechnology Condensed Matter Physics Atomic and Molecular Physics and Optics Surface energy Surfaces Coatings and Films Electronic Optical and Magnetic Materials Nanoimprint lithography law.invention Contact angle law Thin-film transistor Metallizing Electrical and Electronic Engineering Composite material Nanoscopic scale Polyimide |
| Zdroj: | Microelectronic Engineering. 85:1561-1567 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2008.02.015 |
| Popis: | The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated; the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The ~150nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nano-wires lift-off results were also investigated by SEM analysis. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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