Integrated sensors for health monitoring in advanced electronic systems
| Autor: | Andrew Richardson, Marc P.Y. Desmulliez, Changhai Wang, Yufei Liu |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
Microelectromechanical systems
System in package Intelligent sensor Warning system Application-specific integrated circuit Computer science Microsystem Electronic engineering ComputerSystemsOrganization_SPECIAL-PURPOSEANDAPPLICATION-BASEDSYSTEMS Surface acoustic wave sensor Fault (power engineering) |
| Zdroj: | 2009 4th International Design and Test Workshop (IDT). |
| Popis: | This paper presents the development of integrated sensors for health monitoring applications in microsystems. Intelligent health monitoring is an emerging method for early diagnostic of the status or “health” of electronic systems and products under operation based on embedded tests. In this approach miniature sensors are used to monitor the key parameters of the package/system for example temperature, pressure, stress and humidity. Based on the outputs of the sensors stimuli are then used to test the responses of the system to determine its behavior. Thus early warning of system fault or failure can be obtained and measures taken for repair work or replacement of the system. We have been developing integrated sensors on a chip for heath monitoring applications in electronic systems. Integrated sensors on LiNbO 3 and silicon substrates are being investigated. In this paper we report the development of discrete sensors and the integration methods. Thin film temperature sensor arrays have been developed and tested as embedded sensors in substrate assemblies. SAW based low cost sensors have been designed and fabricated for humidity monitoring. Methods for sensor integration and the preliminary results are described. |
| Databáze: | OpenAIRE |
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